AI MEMORY FUSION
邁億智融
Mission
Delivering disruptive AI memory solutions through a vendor-agnostic UMA for heterogeneous AI/HPC—real-time, no HBM required—powered by RF-PAM SerDes Bus Replicator and Memory Expansion Bridge.
Cutting Edge Technology
Memory-Centric Architecture for Edge AI Application: Chiplet
/Chipset UMA Hybrid
Core
Competence
Bus Replicator IP — Foundry-ready hard-macro for leading foundries, including integrated bus initiator and bus target cores
Memory Expansion Chipsets — Extend bandwidth and capacity while preserving a vendor-agnostic UMA
Custom Design Services — Tailored AI SoCs and chiplets, from architecture through bring-up
Engineering White Paper
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interconnect: Principles and Performance Limits in Chiplet/Chipset SoC Architectures and Parallel System Scaling
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Software-Hardware Co-optimzation for AI Edge Devices
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Software-Hardware Architecture for Deploying Real-Time AI Agents: Robotic Applications
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互連： 芯片組/芯片SoC 架構及并行系統擴展的原理和性能限制
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Demystifying the Challenge and Memory Architecture for Embodied/Agentic AI chip
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